Recommendation

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Thermal Impact

Specification • The JAS mechanical structure shall be designed to maintain the electronics/PCBs within given displacements while the system is in operation as applied by determining thermal impacts on the mechanical structure. The operational thermal environments of a nominal orbit need to be applied to the mechanical model as necessary to ensure...

Mechanical Specification > Environmental Exposure > Thermal Impact

Thermal Loads

Specification • Yield and ultimate thermal loads for hardware subject to thermal tests shall be calculated by either Alternate A or Alternate B, as defined below, whichever produces the maximum load. These thermal loads are not to be used for fatigue. Alternate A: Yield thermal load (YTL) = Predicted thermal load (PTL)...

Mechanical Specification > Design Constraints > Structural Integrity > Thermal Loads

Transmit TEP Operations

Specification • Transmit TEP ACKs A transmit TEP shall not send an ACK packet. Transmit TEP Sequence Number Allocation Each DATA packet transmitted shall have a sequence number allocated from the TEP's transmit window range of available sequence numbers. CONTROL Packet Sequence Number All CONTROL packets shall be transmitted with a sequence...

Communication Specification > SpaceWire > Protocols > JAS Reliable Data Delivery Protocol > Channel Operations > Transmit TEP Operations

Urgent Messaging

Specification • Urgent messaging is a best-effort priority communications path that does NOT provide for reliable delivery, missing packet detection, or out-of-sequence packet reordering. It may optionally be implemented in this protocol to facilitate an out-of-band transport pathway that may be useful for such things as time broadcasts, exception/error control, meta messages,...

Communication Specification > SpaceWire > Protocols > JAS Reliable Data Delivery Protocol > Overall Functional Description > Urgent Messaging

Vacuum Impact

Specification • The JAS electronics shall consider testing in a thermal vacuum environment because inadequately heat-sunk parts will fail/burn-up. Overheating is the issue, exceeding maximum junction temperatures.

Mechanical Specification > Environmental Exposure > Vacuum Impact

Venting

Specification • The JAS mechanical structure shall have no confined or captured volumes. Venting ports shall be provided to prevent damage, or the release of gases, due to pressure changes during testing, transportation, and launch. Threads need not be vented.

Mechanical Specification > Environmental Exposure > Venting

VPX

Specification • While no specific node-to-node interconnection method is specified in JAS it is highly recommended that the nodes make use of a standards-based chassis and backplane such as VPX defined by VITA. The VPX standard provides high-speed switched serial interconnects between plug-in modules or nodes while providing for parallel bus interconnects...

Electrical Specification > Electrical Interconnects > VPX

Results 101–113 of 113