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Platform Management Service

Specification • The platform management service, service type address 130 is used to configure, manage, and monitor network specific resources. The currently defined platform management service parameters are shown in the following table. Service Type Service Subtype Subtype Description Cmd Tlm Service Parameters Data Types and Description 130 11 Network Topology Upload...

Communication Specification > JAS Packets > Packet Service Definitions > JAS Specific Services Definitions > Platform Management Service

Potential Flight Capability

Specification • Each component of the JAS mechanical structure should consider Flight capability as this will force consideration of design, flight, and test environments described in this specification. The JAS mechanical structure should be designed for the specific application intended.

Mechanical Specification > Mechanical Interface Design > Potential Flight Capability

Power Conversion

Profile • The input power for CH nodes is provided by one or more voltage rails that are distributed throughout the system. This distributed voltage is typically a higher voltage than those required by the components on the board in order to improve efficiency by minimizing losses through distribution. The CH node...

Command and Host Processor Profile > Functional Description > Power Conversion

Power Conversion

Profile • RP Node Power Conversion The input power for RP nodes is provided by a single voltage rail that is distributed throughout the system. This distributed voltage is typically a higher voltage than those required by the components on the board (typically +5 volts) in order to improve efficiency by minimizing...

Reconfigurable Processing Profile > Functional Description > Power Conversion

Power Distribution Architecture

Specification • JAS will accept at least one primary input power source supplied to the system. The primary input power will connect directly to the Power Supply or PS node in a JAS arrangement. The PS node converts the primary input voltage to a lower voltage which is then sent to all...

Electrical Specification > Power Distribution Architecture

Power Supply Profile

Other • The PS profile defines a high-performance power solution, suitable for powering JAS nodes. The PS profile works alongside other nodes within the JAS architecture. The SMAC and Communications profile implement connectivity and data transfer from PS nodes to other nodes in the system. Power Supply Node The figure below illustrates...

Joint Architecture Standard Overview > JAS Profile Introductions > Power Supply Profile

Power Supply Profile

Profile • The PS profile defines a high-performance power solution, suitable for powering JAS nodes. The PS profile works alongside the CH and RP profiles to implement groups of nodes (i.e., boxes) within the JAS architecture. The SMAC and Communications profile implement connectivity and data transfer from PS nodes to other nodes...

Power Supply Profile

Pressure

Specification • The JAS structure shall meet all performance specifications during and after exposure to pressures varying from atmospheric to the space environment of 10-14 Torr. All thermal-vacuum ground based testing shall be conducted at pressures less than 10-6 Torr.

Environmental Specification > Pressure

Pressure Change

Specification • The structure shall be designed to survive the change of pressure specified in the figure below. The launch and ascent pressure environment will lie between Pc(Max) and Pc(MIN). Pressure Change Within the envelope defined in figure above, the local rates of change will remain between the values shown in the...

Environmental Specification > Pressure > Pressure Change

Primary DC to DC Conversion

Profile • PS Node DC-DC Converters The PS node utilizes isolated DC-DC switching converter devices, which provide the primary power conversion capability for this node type. The DC-DC converter converts the primary bus voltage to a regulated secondary voltage that is distributed to the nodes in the system.

Power Supply Profile > Functional Description > Primary DC to DC Conversion

Processing Logic

Profile • RP Node Processing Logic The RP node utilizes a Field-Programmable Gate Array (FPGA) device which provides the primary processing capability for this node type. FPGAs offer customization of the processing logic allowing the RP node to function for a variety of applications. Reprogrammable FPGAs are preferred over one-time-programmable (OTP) FPGAs...

Reconfigurable Processing Profile > Functional Description > Processing Logic

Processing Logic

Profile • SMAC Processing Logic The SMAC utilizes a radiation-hardened, non-volatile FPGA device to provide the primary processing capability for SMAC functions. This FPGA shall always be powered on when system power is applied regardless of the power state of the remainder of the node. It is recommended to use local POL...

System Monitoring and Communication Profile > Functional Description > Processing Logic

Protocols

Specification • The protocols described in the following sections are used for various SpaceWire applications depending on the needs of the communication interface. Remote Memory Access Protocol (RMAP) is a SpaceWire standard used for memory access. JAS Efficient Exchange Protocol (JEEP) and JAS Reliable Data Delivery Protocol (JRDDP) are both specific to...

Communication Specification > SpaceWire > Protocols

Quasi-Static Loads

Specification • Quasi-static loads shall be applied per the program Strength Qualification Plan. The axial and radial acceleration loads are to be applied simultaneously for an 11 g (TBD?) load in the worst case direction.

Environmental Specification > Loads > Quasi-Static Loads

Radiation Effects Mitigation

Specification • The primary space effect requiring mitigation is the radiation environment, which causes gradual degradation of electronic devices and single event effects (SEE). Parts that have demonstrated destructive SEE, such as SEL or SEGR, should not be incorporated into the node unless absolutely necessary. It is equally important to test the...

Environmental Specification > Radiation Effects Mitigation

RapidIO Interconnect

Profile • RapidIO technology is a packetized point-to-point interconnect fabric. Packets carry user-definable payloads from 1 to 256 bytes. Both serial and parallel physical interfaces are defined, allowing effective data rates from 667 Mbps to 30 Gbps. The serial version of RapidIO was chosen for JAS because it requires a small number...

Communication Profile > Interconnect Technologies > RapidIO Interconnect

RapidIO Logical

Profile • The Logical Layer specifications define the operations and associated transactions by which end point processing elements communicate with each other. It is composed of several specifications, each providing packet formats and protocols for different transaction semantics. The Logical I/O specification defines packet formats for read, write, write-with-response, and various atomic...

Communication Profile > Interconnect Technologies > RapidIO Interconnect > RapidIO Logical

RapidIO Physical

Profile • The Physical Layer defines how adjacent processing elements electrically connect to each other. The physical layer specifications describe the electrical requirements for connecting endpoints and switches together. The Parallel Physical specification was deprecated in 10/2013 and is no longer used. The Serial Physical specification outlines the requirement for devices utilizing...

Communication Profile > Interconnect Technologies > RapidIO Interconnect > RapidIO Physical

RapidIO Transport

Profile • The Transport Layer defines how transactions are routed from one end point processing element to another through switch processing elements. The Transport specification describes the header information added to a RapidiIO packet and the way the header information is interpreted by a switching fabric. Every RapidIO endpoint is uniquely identified...

Communication Profile > Interconnect Technologies > RapidIO Interconnect > RapidIO Transport

Rear Transition Module

Profile • This instantiation provides a breakout for backplane signals per the VITA 46.10 specification. A rear transition module (RTM) attaches to the back side of a backplane directly behind and in-line with a front plug-in module (usually a node). The RTM provides accessibility to signals such as communication breakouts, power connectivity,...

Expansion Profile > Applications > Rear Transition Module

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