Profile • The recommended CH implementation is on a 6U VPX board, as defined in the VITA 46 standard and the Mechanical Specification. VPX is preferred for a number of reasons, a few of which include: 3U and 6U board formats to accommodate varying sizes High-density connectors and flexible pinout Availability of...
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Mechanical
Profile • Exact mechanical specifications will vary widely depending on the type of module and the location where it will be integrated into the system. However, there are two predominant applications for the expansion module: a mezzanine board for CH or RP profiles or a RTM to attach to a backplane. Mezzanine...
Mechanical
Profile • The recommended PS implementation is on a 6U VPX board, as defined in the VITA 46 standard and the Mechanical Specification. VPX is preferred for a number of reasons, a few of which include: 3U and 6U board formats to accommodate varying sizes High-density connectors and flexible pinout Availability of...
Mechanical
Profile • The recommended RP implementation is on a 6U VPX board, as defined in the VITA 46 standard and the Mechanical Specification. VPX is preferred for a number of reasons, a few of which include: 3U and 6U board formats to accommodate varying sizes High-density connectors and flexible pinout Availability of...
Mechanical Interface Design
Specification • The JAS mechanical structure as described in this Mechanical specification will support applications intended for a space environment and will provide stable mechanical structure for the electronics during launch and while operating in a high vacuum.
Mechanical Specification
Specification • The Mechanical Specification provides details about mechanical interface design, environmental impacts, and design constraints that should be considered for implementing mechanical structures in a JAS-based system. The figure below provides context of where the Mechanical Specification resides in the JAS standard. JAS Standard Hierarchy
Megabit Interfaces
Profile • There are several megabit interfaces that may be utilized on the CH node. Some examples of these include: SpaceWire RS-422, RS-232 MIL-STD-1553 CAN bus SpaceWire is the preferred solution for systems requiring data rates below 200 Mbps. SpaceWire links can scale from 2 to 200 Mbps at full duplex and...
Megabit Interfaces
Profile • There are several megabit interfaces that may be utilized on the RP node. Some examples of these include: SpaceWire RS-422, RS-232 MIL-STD-1553 CAN bus SpaceWire is the preferred solution for systems requiring data rates below 200 Mbps. SpaceWire links can scale from 2 to 200 Mbps at full duplex and...
Megabit Interfaces
Profile • There are several megabit interfaces that may be utilized on the RP node. Some examples of these include: SpaceWire RS-422, RS-232 MIL-STD-1553 CAN bus SpaceWire is the preferred solution for systems requiring data rates below 200 Mbps. SpaceWire links can scale from 2 to 200 Mbps at full duplex and...
Megabit-class Interfaces
Profile • There are several megabit-class interfaces that may be utilized on the PS node. Some examples of these include: SpaceWire RS-422, RS-232 MIL-STD-1553 CAN bus SpaceWire is the preferred solution for systems requiring data rates below 200 Mbps. SpaceWire links can scale from 2 to 200 Mbps and are well suited...
Memory Access Service
Profile • The Memory Access Service is used to asynchronously read and write to memory-based devices across a network. The Memory Access Service is based on the CCSDS SOIS Memory Access Service and provides a layer of abstraction between applications and memory-based devices. It provides a common API for applications to use...
Memory Access Service
Specification • Error: unable to migrate element with tag="" The following diagram shows how the JAS Memory Access Service fits into the overall communication stack. The Memory Access Service provides a standard interface to applications that allows them to remotely access memory on a JAS node across a communication link. This is...
Memory Storage
Profile • Another possible instantiation of this profile is to include non-volatile memory and/or SRAM/SDRAM storage on a CH or RP node. Memory Storage Instantiation
Memory Technologies
Profile • There are two types of memory technologies that are highly recommended for inclusion on the CH node: non-volatile flash or EEPROM, and higher-speed SRAM or SDRAM memory. Non-volatile memory is necessary to store the software that the microprocessor will execute upon power-up. Non-volatile memory may also be necessary to store...
Memory Technologies
Profile • RP Node Memory Technologies External memory is often included on RP node instantiations to support the FPGA’s processing. Among other uses, memory provides storage for sensor data and working space to implement processing algorithms. Any combination of memory technologies, including Synchronous Dynamic Random Access Memory (SDRAM), Static Random Access Memory...
Mezzanine Connector
Specification • A very useful option for plug-in modules is the ANSI/VITA 57 standard FPGA Mezzanine Card or FMC. This standard specifies an industry standard form factor utilizing a low profile, high-speed, high-pin count connector. The FMC connector can support very high bandwidths. The FMC approach solves the problem of how to...
Microprocessor
Profile • The CH Node is a microprocessor-based node that executes software stored in supplemental on-board memory. It is highly recommended that this microprocessor be radiation-hardened for reliability. The processor is typically attached to a non-volatile memory technology and a faster SRAM or SDRAM memory. A bus interface between the microprocessor and...
Mission Data Processing
Profile • This application employs the CH node as a mission data processor, utilizing the radiation-hardened microprocessor and on-board memories to perform computations in support of the payload’s mission. Additional optional memories or other board capabilities may be built onto the expansion port if desired. Mission Data Processing Instantiation This application is...
Molecular Contamination
Specification • For all components that will be in the vicinity of an optical payload and anywhere that contamination at the molecular level is an issue, all parts and materials must comply with ASTM E 595 for less than 1% Total Mass Loss (TML) and 0.1% CVCM. Thermal bake-out of all components...
Molecular Thermovac Testing
Specification • Thermovac temperature testing is required to determine dissipation at full power modes. A test plan needs to be developed and coordinated with the System Engineer.
Mounting Distortion Impact
Specification • The JAS mechanical structure shall maintain the electronics/PCBs listed below within given positions with distortions less than expected for the intended application.
Multicast/Broadcast
Profile • SpaceWire doesn’t inherently support a multicast or broadcast capability. There is a time-code distribution function but it is limited in the amount of user information that can be distributed. An approach has been developed for a broadcast capability through custom router and endpoint modifications. It uses a set of dedicated...
Multiplexed Logical Channels
Specification • The protocol shall support multiple simultaneous logical connections over a single SpaceWire link.
Network Discovery
Profile • When probing for routing switches, early network discovery techniques typically relied on each routing switch’s configuration port to respond to identification requests to confirm the routing switch’s presence. A request packet was typically dispatched to the configuration port, and a response packet provided confirmation of existence. This same request/response approach...
Network Interfaces
Profile • All JAS nodes communicate through a standard set of interfaces that adhere to standard protocols. Refer to the Electrical Specification for physical layer technical information and Communication Specification for details on standard data protocols. This section describes two classes of network interfaces, megabit interfaces with line speeds below one gigabit...
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