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System Monitor and Communication Profile

Other • The System Monitoring and Communication (SMAC) Profile defines a subsystem intended for integration into JAS nodes to provide control, communication, and state-of-health (SOH) monitoring capabilities. The SMAC subsystem consists of a single, common design applied to all nodes which provides a consistent interface to the system controller regardless of the...

Joint Architecture Standard Overview > JAS Profile Introductions > System Monitor and Communication Profile

System Monitoring and Communication

Profile • PS Node System Monitoring and Communication An important element that must be included in each PS node is described in the SMAC Profile. The SMAC monitors and controls the state of the PS node. The SMAC also provides standard network interfaces for connectivity to other nodes.

Power Supply Profile > Functional Description > System Monitoring and Communication

System Monitoring and Communication Profile

Profile • The System Monitoring and Communication (SMAC) Profile defines a subsystem intended for integration into RP, CH, and PS nodes to provide control, communication, and state-of-health (SOH) monitoring capabilities for JAS nodes. The SMAC subsystem consists of a single, common design applied to all nodes which provides a consistent interface to...

System Monitoring and Communication Profile

Thermal Impact

Specification • The JAS mechanical structure shall be designed to maintain the electronics/PCBs within given displacements while the system is in operation as applied by determining thermal impacts on the mechanical structure. The operational thermal environments of a nominal orbit need to be applied to the mechanical model as necessary to ensure...

Mechanical Specification > Environmental Exposure > Thermal Impact

Thermal Loads

Specification • Yield and ultimate thermal loads for hardware subject to thermal tests shall be calculated by either Alternate A or Alternate B, as defined below, whichever produces the maximum load. These thermal loads are not to be used for fatigue. Alternate A: Yield thermal load (YTL) = Predicted thermal load (PTL)...

Mechanical Specification > Design Constraints > Structural Integrity > Thermal Loads

Time Distribution

Other • The JAS architecture does not specify a time distribution scheme nor limit system implementations from incorporating their own methods. Two possible time distribution schemes are presented as examples: Fully Connected A fully connected distribution provides a direct interface between each node and the host. Fully connected time distribution is more...

Joint Architecture Standard Overview > Time Distribution

Timing Control

Profile • SMAC Timing Control The SMAC includes a time-keeping circuit that is used for synchronizing time across the entire payload. The timekeeping process has two components: receipt of the time value for the next epoch, and synchronization to a timing pulse. The receipt of time value occurs over the network. The...

System Monitoring and Communication Profile > Functional Description > Timing Control

Useful Metrics for Analyzing Topology Candidates

Other • Emerging high-bandwidth, low-latency network technology has made network-based architectures both feasible and potentially desirable for use in satellite payload architectures. Network architectures are capable of routing large amounts of traffic with reasonable latency, allowing considerable amounts of data between nodes to be shared. However, care must be exercised when developing...

Joint Architecture Standard Overview > Network Topologies > Useful Metrics for Analyzing Topology Candidates

Vacuum Impact

Specification • The JAS electronics shall consider testing in a thermal vacuum environment because inadequately heat-sunk parts will fail/burn-up. Overheating is the issue, exceeding maximum junction temperatures.

Mechanical Specification > Environmental Exposure > Vacuum Impact

Venting

Specification • The JAS mechanical structure shall have no confined or captured volumes. Venting ports shall be provided to prevent damage, or the release of gases, due to pressure changes during testing, transportation, and launch. Threads need not be vented.

Mechanical Specification > Environmental Exposure > Venting

Vibration (Random)

Specification • The JAS housing support shall meet all performance specifications after being subjected to the vibration level prescribed by figure 5.5.1. This spectrum shall be applied, to the mounting brackets.

Environmental Specification > Vibration (Random)

VPX

Specification • While no specific node-to-node interconnection method is specified in JAS it is highly recommended that the nodes make use of a standards-based chassis and backplane such as VPX defined by VITA. The VPX standard provides high-speed switched serial interconnects between plug-in modules or nodes while providing for parallel bus interconnects...

Electrical Specification > Electrical Interconnects > VPX

X,Y, and Z Axis Random Vibration

Specification • The JAS support shall meet all performance specifications after being subjected to the random vibration environment prescribed by the figure below. Note that these are acceptance levels. This input should be used along with the program Strength Qualification Plan. Random Vibration

Environmental Specification > X,Y, and Z Axis Random Vibration

Results 101–119 of 119