Interconnect Technologies

This profile describes the interconnect technologies supported by JAS. Each interconnect will be comprised of three layers based on the RapidIO standard: the Logical Layer; the Transport Layer; and the Physical Layer. The figure below shows a mapping of the interconnect layers to the OSI layers. The Application Layer is represented by the JAS subnetwork services. The Logical Layer defines protocols for communication between end-point processing elements. The Transport Layer routes messages from one end-point processing element to another through switch processing elements. The Physical Layer electrically connects adjacent processing elements to each other.

There are two primary data links covered in this communication standard, SpaceWire and Serial RapidIO (SRIO). This is a modular specification so new technologies may be added in the future as necessary.